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Professional equipment provider in the field of chip packaging
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Wafer Auto Packing Machine
For 3/4 inch thin wafers (min. thickness 60~100 μm). This allows for precise alignment calibration

The process supports automatic loading into trays and coin boxes via SECS and local recipe commands respectively

Packaging includes wafers, trays, foam pads, and discs as buffering materials

Content identification involves reading

Cassette ID: One-dimensional/two-dimensional code

Wafer ID: OCR

Cleanroom level: Class 100

UPH < 500 (calculation condition: 2 foam pads, 12 wafers, 1 spacer disc)

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