Compatible Equipment for Frame Assembly-IGBT power module equipment-Changyuan Semiconductor Equipment (Zhuhai) Co., Ltd

Compatible Equipment for Frame Assembly

Suitable for ECONO series, ECONO PACK2, ECONO PACK3, and ECONO DUAL3 packaging,compatible with HPD, HP1 packaging, It mainly includes processes such as dispensing, 3D inspection, laser marking, screw locking, snap ring riveting, screw floating height detection, snap ring 2D inspection, etc.

Excellent productivity : Econo series <20 sec/module, HPD <30 sec/module

Precise positioning : Positioning accuracy up to 0.05mm

Dispensing system : Glue quantity +/-10% with Cmk >2

Dispensing range : X/Y position +/- 0.2 mm; 3D inspection trajectory, position accuracy, glue width, glue height, and broken glue

Servo press : pressure-displacement curve, real-time display

Tightening system : screw torque angle monitoring

MES system : factory MES docking, formula automatic calling, process parameters uploading to the MES system

Modular design : easy to upgrade according to customer request

Strong compatibility : Compatible with HPD, HP1, Econopack2, Econopack3.

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Project	规格描述
UPH	Econo series<20 seconds/module, HPD/HP1<30 seconds/module
Assembly accuracy	0.1mm
Code reading error rate	<0.01%
Repeatability	<0.05mm
CCD positioning accuracy	0.014mm
Servo press	Press stroke: 200mm; Press pressure: 3T; Press speed: 0-200mm/s
Cmk	>1.67
Support functions	Operation permission management, machine communication, and transmission should comply with SMEMA standard interface types such as Secs/Gem to achieve product traceability requirements