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    Professional equipment provider in the field of chip packaging
    Wafer-level Packaging Equipment
    IC Packaging Equipment
    IGBT power module equipment
    SiP Equipment
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    IC Packaging Equipment
    11
    High Precision Multi-heads Bonder
    Model: CYG-GM4U
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    2
    Chip Inspection and Sorting Machine
    Model : CYG-DS24A Click to consult
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    1212
    Specification Description
    Model : CYG-DB1200Plus Click to consult
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    44
    Fully Automatic Chip Sorter
    Model : CYG-DS 1200 Click to consult
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