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    Professional equipment provider in the field of chip packaging
    Wafer-level Packaging Equipment
    IC Packaging Equipment
    IGBT power module equipment
    SiP Equipment
    Other Automation Equipment
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    IGBT power module equipment
    C1
    IGBT Device Pin Inserting Machine
    Model: CYG-ZP1U
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    C2
    IGBT Automatic Assembly Line
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    C3
    Vacuum Reflow Automatic Line
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    C4
    Compatible Equipment for Frame Assembly
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    C5
    Automatic Vacuum Potting and Capping Line
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    C6
    Optional Packaging Machine
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    C7
    Housing Dispensing, Assembly, Curing Equipment
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    C8
    Pre-sinter Bonder
    Model: CYG-GM4U-S
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