| Project | Specification Description |
| UPH | <=8K（depending on chip size and pick-and-place process parameters） |
| Chip Thickness | 0.2-0.7mm |
| Chip Size | 0.5x0.5 mm~25x25 mm |
Placement Accuracy | XY: ± 50μm(3σ)，θ± 1゜ |
| Pick up Force | 60~250g |
| Wafer Size | 12 inch standard（8inch / 6inch optional） |
| Wafer Loading/Unloading | Fully automatic ( 12 inch wafer cassette ) |
| Wafer Mapping | Supports standard wafer map format |
| Wafer Bin Number | 1 bin(standard)、3 bin(option) |
| Tray Loading/Unloading | Fully automatic (tray stacked loader and unloader, 30 pcs.) |
| Tray Size | 2”、3”、4"Chip Tray |
| Weight | 1200kg |
Fully Automatic Chip Sorter
This equipment is suitable for chip sorting process after wafer dicing. Chips are picked up from wafer by visual identification, positioning, then placed into a dedicated carrier, such as waffle pack tray，tape frame or other carriers.
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