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Professional equipment provider in the field of chip packaging
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EFEM
Suitable for handling 4/6, 8/12 inch wafer products.

Loading and unloading methods: Supports FOUP, Open Cassette, and Coin Box

Basic functions: Includes Auto Mapping and Notch Alignment

Optional functions: OCR, Barcode Reader, SCES/GEM.

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ProjectSpecification Description
DimensionsW1440XD1260XH2250
Wafer Input/Output300mm FOUP 25pcs(SEMI E47.1)、FOSB 25 pcs(SEMI M31) or 300mm FOUP with 8’Open Cassette/SEMI Standard : E47.1, E62
Wafer Size200mm-300mm, Thickness0.4-1.0 mm
Throughput200pcs/H
Clean LevelISO Class2 (FFU)
Load Port2 Port
Clean Level500Kg
Utilities

Power:AC220V50HZ/Dryair:0.5MPa+10%/Vacuum:>-53KPa