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Professional equipment provider in the field of chip packaging
C2
IGBT Automatic Assembly Line
Suitable for ECONO series, HPD packaging, it mainly including DBC mounting, reflow soldering, positioning frame disassembly, cleaning, X-Ray, housing glue dispensing, room temperature aging cabinet bonding and cleaning, vacuum potting, high temperature curing furnace, and housing packaging and unloading.

High productivity : Econo series <20s/module, HPD/HP1 <30s/module.

Accurate positioning : positioning accuracy up to 0.02mm

Automation rate >90%, saving 12 workers per shift, only two personnel online responsible for bond inspection

Dispensing system : glue volume: ±10% with Cmk >2

Dispensing range : X/Y position:±0.2mm; 3D detection trajectory and break detection

Potting curing: online dual pipeline potting, high production efficiency

Wire bonding automation : 12 wire bonders are connected to the main line as support

Customized design such as cleaning baskets, DBC positioning frames, bonding fixtures and other production auxiliary tools meet various requirements

Module design : easy to upgrade according to customer request

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ProjectSpecification Description

UPH

Econo series <20 s/module, HPD/HP1 < 30 s/module

DBC mounting Accuracy

0.05mm

Bar Code Reading error rate<0.01%
Repeat Positioning Accuracy

<0.05mm

CCD Positioning Accuracy

0.014mm

Servo PressPressing stroke : 200mm;Pressing force : 3T; Pressing speed:0-200mm/s
Glue Mixing Method

Static mixing tube

Equipment Operating Noise

Continuous noise ≤70dB(A) (measured at a distance of 1.5m from the equipment)
Equipment Stability and Reliability

MTBF≥168h, MTTR≤20mins, MTBA≥3h, MTTA≤3mins

Failure Rate<2%
Cmk

>1.67

Supporting FunctionsOperation authority management, communication with the machine and compliance with SMEMA standards, interface types should meet Secs/Gem and other types, to achieve product traceability requirements.