Automatic Vacuum Potting and Capping Line-IGBT power module equipment-Changyuan Semiconductor Equipment (Zhuhai) Co., Ltd

Automatic Vacuum Potting and Capping Line

Suitable for ECONO series, ECONO PACK2, ECONO PACK3, and ECONO DUAL3 packaging, as well as HPD and HP1 packaging, compatible with 34mm, 62mm, Easy 1B/2B/3B. It mainly includes sealing glue curing, cleaning before potting, vacuum potting, curing after potting, and capping process.

Excellent production capacity: HPD <30s/module, Econo <20s/module

Accurate positioning : positioning accuracy up to 0.05mm

Gluing system : Dispensing accuracy ±1%; mixing ratio accuracy ±1%; X/Y position±0.2 mm

Three-step independent vacuum box to reduce vacuum time

High-temperature curing : temperature error control within the set value of ±5℃, automatic temperature detection sensor

Modular design : easy to upgrade according to customer needs

Compatibility : Compatible with HPD, HP1, Econopack2, Econopack3 series products

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Project	Specification Description
UPH	Econo series<20 seconds/module, HPD/HP1<30 seconds/module
Glue filling system	Glue dispensing accuracy+/-1%; Mixing ratio accuracy+/-1%
Code reading error rate	<0.01%
Repeatability	<0.05mm
CCD positioning accuracy	0.014mm
Cmk	>1.67
Support functions	Operation permission management, machine communication, and transmission should comply with SMEMA standard interface types such as Secs/Gem to achieve product traceability requirements