Housing Dispensing, Assembly, Curing Equipment-IGBT power module equipment-Changyuan Semiconductor Equipment (Zhuhai) Co., Ltd

Housing Dispensing, Assembly, Curing Equipment

Suitable for ECONO DUAL3 packaging, it mainly includes side frame feeding, side frame marking, substrate dispensing, side frame substrate assembly, online heating and curing process.

Excellent production capacity: Econo series <20s/module

Accurate positioning: positioning accuracy up to 0.05mm

Dispensing system: glue volume±10% with Cmk >2

Dispensing range: X/Y position±0.2mm

3D inspection for path, position, glue width, glue height, broken glue

Heating and curing: heating temperature range from room temperature ~ 200℃ with accuracy of within ±1℃

Temperature uniformity: unloaded within±3℃ (measured at five points), loaded within±5℃ (measured at five points)

MENS system : integration with factory MES, automatic formula recipe, and process parameter uploading to MES system

Modular design : easy to upgrade according to customer’s requests

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Project	Specification Description
UPH	Econo series<20 seconds/module
Assembly accuracy	0.1mm
Code reading error rate	<0.01%
Repeatability	<0.05mm
CCD positioning accuracy	0.014mm
Cmk	>1.67
Support functions	Operation permission management, machine communication, and transmission should comply with SMEMA standard interface types such as Secs/Gem to achieve product traceability requirements