Pre-sinter Bonder-IGBT power module equipment-Changyuan Semiconductor Equipment (Zhuhai) Co., Ltd

Pre-sinter Bonder

This equipment is suitable for high precision and high temperature prefixed crystal of SiC chips Support the pressure sinter paste or the pressure sinter film process

Modular design, compatible with various chips, solder pads, graphite frames, substrate fixtures, and other feeding modules that can be flexibly configured to meet the production needs of various products and processes

Compatible with 8-inch/12 inch wafer basket feeding, different chips and materials can automatically replace suction nozzles and top pins

Automated QR code scanning for intelligent management of product information

Can achieve patch accuracy ≤+/-10 μ m

Modular design can quickly adapt to different products and processes for customized services, with simple operation and maintenance

Modular mechanical interface can be used for single machine or string flexible configuration applications, with high cost-effectiveness

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Project	Specification Description
SMT method	Solder pads, solder paste
Chip SMT accuracy	X/Y ± 10 μ m (3 σ, based on calibration block verification accuracy)
Production speed	CT 1s (pick-up and drop time) UPH depends on the product process and quantity
Product size	Chip size 1.5 * 1.5~20 * 20mm, chip thickness 0.05~0.2mm DBC size supports width 30~50mm, thickness 0.9~1.2mm
Range of loading and unloading force control	30-300g
Welding blade cutting accuracy	±0.1mm
Patch size	8-inch (6-inch compatible)
Support product delivery methods	Wafer or waffle box stacking materials, vibration discs, Feida, Tray and frame stacking, Magazine, etc . FRD, IGBT chip, NTC and its solder pads, frame DBC、 Tooling, Space, etc
Support product types	FRD, IGBT chip, NTC and its solder pads, frame DBC、 Tooling, Space, etc
Compatible tray size	The track width can be adjusted from 85mm to 332mm
Bangtou rotation angle	360
Automatically change the number of suction nozzles	12 groups
Automatic replacement of ejector pin module	3 groups
Other	Optional modules include spray adhesive fixed patch module, scanning function module (including wafer, DBC, tooling, and tape), and dispensing function module
Equipment size	1200 * 1500 * 2200mm (excluding protruding equipment body) 2000 * 1900 * 2200mm (including front and rear docking tracks and protruding equipment parts of flower basket lifting platform)