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    Professional equipment provider in the field of chip packaging
    Wafer-level Packaging Equipment
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    SiP Equipment
    01
    Automatic Tape Mounter
    Suitable for IC assembly and sputtering process and is designed for tape mounting of 12 inch and smaller wafer frame or square frames.

    Supports feeding of UV tape, blue tape, or roll film with release tape

    Compatible with magazine or cassette feeding of wafer frames

    Adjustable feeding track width for greater flexibility

    Tape mounting motion programable

    Tension of tape can be adjusted as per requirement

    Automatic cutting tape after mounting with adjustable front and back knife position

    Supports 180°flipping after tape mounting

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    ProjectSpecification Description

    UPH

    >90pcs

    Tape Mounting Accuracy

    ±0.2mm

    Grasp the iron ring method

    Vacuum Nozzle

    Support iron ring size

    Maximum 12 inch frame or 240x215mm square frame

    Membrane replacement time15-20mins

    Frame flip function (after mounting)

    180°