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    Professional equipment provider in the field of chip packaging
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    SiP Equipment
    012
    Scanning and Pressing all-in-one Machine
    Suitable for IC assembly and sputtering process for the products such as Package, QFN, BGA, and LGA, It can improve the bonding effect between the product and the adhesive film before sputtering, preventing adhesive overflow from gaps between the film and the product.

    The high resolution camera scans the products, the data of products and the frame can be uploaded to the system.

    Integrated MES function for product scanning and information management

    The travel of press is controllable with precision of ±0.01mm

    Pressure is controllable with a high-precision pressure sensor with accuracy of ±0.5kg

    Press time can be adjusted according to the different requirements of products

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    ProjectSpecification Description

    Press Force

    0kg-200kg

    Press Time

    0s-200s

    Flatness of Press Stage

    Platform within 100μm in the effective compression area

    Changeover

    15-20mins

    Maximum Press Size250*250mm
    Scanning Accuracy

    >99.99%