UV Irradiation Machine-SiP Equipment-Changyuan Semiconductor Equipment (Zhuhai) Co., Ltd

UV Irradiation Machine

Suitable for IC assembly and sputtering process, and can be used for UV tape detaping process, UV tape viscosity removal and other processes of optical lenses, filters, LEDs, integrated circuit boards and other semiconductor materials.

Uses LED light to irradiate for tape debonding

Compatible with magazine and cassette loading and unloading

No preheating required and power adjustable for different light intensity requirements

Wide range of applications, does not affect the temperature and thermal deformation of the debonding area

UV irradiation power and time are adjustable

Applicable to 3000mj/cm2, irradiation time ≤10s

Supports SECS/GEM protocol : SEMI E5, E30, E37, E37.1, E142.

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Project	Specification Description
UV Energy	>3000mj/cm2
Wavelength	365mn
lrradiation Temperature	<60°C
Supported lrradiation Range	250*250mm
SECS/GEM Protocol	SEMIE5、E30、E37、E37.1、142
Dimension	11005501750mm