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Professional equipment provider in the field of chip packaging
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Apply Protective Film Machine
Applied to high-precision attachment of protective film and shipping film on the surface of PCB substrates in Mini LED backlight PCB substrate process.

On-line equipment, compatible with 12/14/16 inch protective film stacked loading.

The angle of tear-off path and film peel-off can be adjusted with a range of 0-55 degrees.

The high-precision air pressure adjustment, combined with high-precision pressure monitoring, providing real-time control of the film-attaching pressure. 

High-precision CCD vision error compensation.

Automatic scanning and uploading of production data to monitor the  production status throughout the process, with one-click production report generation and docking with MES.

UPH : 210

Film attachment accuracy : ±0.2 mm

Meet Class 100 cleanroom standards.

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ProjectSpecification Description
Input VoltageAC 220V 50HZ
Power

5 KW

Air Pressure

0.5-0.7MPa

Dimension

L*W*H:1800*2000*2200mm

Weight950kg
Environmental Temperature

22+5°C

Cleanliness Level1000
CT (in put)18
UPH(out put)192
Yield

99%